Ma'aunin Fasaha
| Abun ciki | Abun ciki | CAS No. |
| Ruwa mai tsafta | 85-90% | 7732-18-5 |
| Sodium benzoate | 0.1-0.2% | 532-32-1 |
| Surfactant | 4-5% | ∕ |
| Wasu | 4-5% | ∕ |
Siffofin samfur
1, High muhalli kariya matakin: Zaɓaɓɓen etching za a iya cimma ba tare da yin amfani da Organic tushe kamar TMAH.
2, Low samar kudin: Amfani NaOH / KOH matsayin etching ruwa, da kudin ne da yawa m fiye da acid polishing da etching tsari.
3, High etching yadda ya dace: Idan aka kwatanta da acid polishing da etching tsari, da baturi yadda ya dace ya karu da fiye da 0.15%.
Aikace-aikacen samfur
1, Wannan samfurin ne gaba ɗaya dace da Perc da Topcon baturi tafiyar matakai;
2, dace da guda lu'ulu'u na 210, 186, 166, da kuma 158 bayani dalla-dalla.
Umarnin don amfani
1. Add wani dace adadin alkali a cikin tanki (1.5-4% bisa KOH / NAOH girma rabo)
2. Add da dace adadin wannan samfurin a cikin tanki (1.0-2% dangane da girma rabo)
3. Duma ruwan tanki mai gogewa zuwa 60-65 ° C
4. Sanya wafer siliki tare da cire PSG baya a cikin tanki mai gogewa, lokacin amsawa shine 180s-250s
5, Shawarar nauyi asara ta gefe: 0.24-0.30g (210 wafer tushen, sauran kafofin suna tuba a daidai rabbai) guda da polycrystalline PERC hasken rana Kwayoyin.
Matakan kariya
1. Additives bukatar da za a adana tsananin nesa da haske.
2. Lokacin da samar line ba samar, da ruwa ya kamata a replenished da drained kowane minti 30.Idan ba a samar da fiye da sa'o'i 2 ba, ana bada shawara don magudana da sake cika ruwa.
3, New line debugging na bukatar DOE zane dangane da kowane tsari na samar line cimma tsari matching, game da shi maximizing yadda ya dace.Hanyar da aka ba da shawarar za a iya komawa zuwa gyara kuskure.
